Samsung Scores Coup by Hiring Former TSMC Exec

Samsung has appointed Lin Jun-cheng, who worked at its foundry business rival TSMC, who will serve as a senior vice president of the advanced packaging team under Samsung's chip business division, device solutions.  Read more: What Does TSMC’s $40 Billion Investment Mean for Chipmakers? Jun-cheng, who was in TSMC for 19 years, played a significant role in the development of 3D packaging technology at the Taiwan-based chip-making giant. Before joining Samsung, he served as the chief of Skytech, a semiconductor equipment firm in Taiwan. Prior to his tenure at TSMC, Lin worked for US-based Micron Technology which specialises in memory semiconductors. Lin's recruitment by Samsung coincides with the company's strong investment in advanced packaging technology, an area where it has